Electrosurgical adhesiolysis and dissection of endometriotic lesions in case of DIE using TriSect rapide®

Endometriosis electrosurgery removes endometriotic lesions and adhesions. The TriSect rapide® is ideally suitable for open and laparoscopic treatment of deep infiltrating endometriosis (DIE). Here you can follow the laparoscopic approach using this multi-tool powered by … Continue reading Electrosurgical adhesiolysis and dissection of endometriotic lesions in case of DIE using TriSect rapide®

Laparoscopic adhesiolysis with LAP BiSect Micro

Adhesions in the upper abdomen can be lysed very well with the LAP BiSect Micro. Bipolar cutting and coagulation, as seen here, where the omentum was dissected from the abdominal wall.