Hysterectomy in case of laparoscopic treatment of deep infiltrating endometriosis (DIE) using TriSect rapide®

See the TriSect rapide® in use at a laparoscopic hysterectomy. The multi-tool dissects and excises the fallopian tube, transects the ovarian, round and broad ligaments, and dissects ureter and uterine pedicles. TriSect rapide is powered … Continue reading Hysterectomy in case of laparoscopic treatment of deep infiltrating endometriosis (DIE) using TriSect rapide®

Electrosurgical adhesiolysis and dissection of endometriotic lesions in case of DIE using TriSect rapide®

Endometriosis electrosurgery removes endometriotic lesions and adhesions. The TriSect rapide® is ideally suitable for open and laparoscopic treatment of deep infiltrating endometriosis (DIE). Here you can follow the laparoscopic approach using this multi-tool powered by … Continue reading Electrosurgical adhesiolysis and dissection of endometriotic lesions in case of DIE using TriSect rapide®

BiClamp® LAP and LAP BiSect in gynecological surgery – a testimonial by Dr. Ma Li, University Hospital Singapore

Sealing of vessels and tissue structures and precise bipolar dissection are important working steps in gynecological surgeries. Erbe therefore provides reliable and reusable surgical instruments – BiClamp® LAP and LAP BiSect Micro. Dr. Ma Li … Continue reading BiClamp® LAP and LAP BiSect in gynecological surgery – a testimonial by Dr. Ma Li, University Hospital Singapore

VIO® 3 Technology – selected features

The VIO® 3 technology presentation provides you with additional information and explanations of Erbe’s technology on the VIO® 3 microsite. There you can also find out which differences there are between power and voltage control.